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You are viewing titles for STATE UNIVERSITY OF NEW YORK AT BINGHAMTON in the Packaging available through the UMI Dissertations & Thesis Gradwoorks site
 
Computational drop testing of printed circuit boards with BGA components
 Development of nano-characterization system for polymer film measurement and single BGA solder joint forming experiment
 
Effect of thermal and mechanical factors on single and multi-chip BGA packages
 Application of artificial neural networks to predict defect levels in wave soldering processes
 
Thermodynamics and kinetics of oxidation and temperature dependent mechanical characterization of pure indium solder
 Thermal management in 3D packaging
 
Drop test energy relationship to reliability
 Underfill selection methodology for component underfilling process
 
A systematic approach for selection of best Pb-free printed circuit board (PCB) surface finish
 Evaluation and improvement of the robustness of a PCB pad in a lead-free environment
 
Stress relieving technique for plastic packages in a high volume manufacturing environment
 Experimental and analytical studies of the high cycle bending fatigue of thin films on flexible substrates for flexible electronics applications
 
Resource and production planning - post ERP implementation at an EMS provider
 A comprehensive manufacturing and reliability study of an interposer based 3-D package