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You are viewing titles for GEORGIA INSTITUTE OF TECHNOLOGY in the Packaging available through the UMI Dissertations & Thesis Gradwoorks site
 
Mechanism of foaming on polymer-paperboard composites
Study of Sn-Ag-Cu alloy reliability through material microstructure evolution and laser moire interferometry
 
Adhesion mechanisms of nano-particle silver to electronics packaging materials
Novel conductive adhesives for electronic packaging applications: A way towards economical, highly conductive, low temperature and flexible interconnects