As we explore feasibility of higher frequency bands for higher bandwidth in wireless technology, low loss and reliable millimeter-wave modules have to be developed in order to meet industry and government demands. This thesis presents design and development of low loss and light weight organic Liquid Crystal Polymer (LCP) hermetic surface mount packages for up to Ka-band applications.

Detail design and characterization of package feed-through are presented. A package feed-through design includes a tapering coplanar waveguide launch on a printed circuit test board, CPW structure at the bottom of package substrate, via transition that includes a via and two via pads above and below a substrate, microstrip line on top of substrate and a bond wire transition that connects package microstrip to MMIC. We demonstrate that organic packages can provide millimeter-wave performance.

We expand the LCP packaging technology capability by demonstrating a Ka-band multi-chip receiver down-converter module using multi-layer LCP surface mount packages, incorporating our millimeter-wave package feed-through design. Module base area is expanded to 400% of a single chip package size. Performance of a multi-chip LCP module is evaluated by measuring RF to IF conversion-gain and loss analysis throughout the module is given.

Sealing of package is done using solely LCP material and lamination technique without usage of any adhesives, which is required to laminate other millimeter wave packaging material such as Dupont's kapton films, Rogers Corporation high frequency laminates, and ceramics. Adhesives may not serve as moisture barrier and may not provide reliable sealing. Development of all-LCP-packages enables near hermetic and reliable shielding from outside environment because of LCP's low moisture absorption characteristic that comes from its permeability being close to glass.

Lastly, long term reliability of LCP packages is investigated. Test vehicles were single amplifier chip packages and a multi-chip Ka-band down-converter module packages. The units went through 9 different accelerated environmental tests including temperature cycle test, operating humidity exposure (85/85) test, mechanical vibration test, etc. All single-chip-packages passed almost all reliability tests, which indicate that our sealing technique is consistent and these LCP packages are qualified to be used reliably in millimeter-wave frequency applications.