This work presents on the manufacturing of optical MEMS devices and interconnected using both traditional and novel MEMS manufacturing techniques. The complexity of MEMS design and fabrication has limited the feasibility of MEMS production to only high volume applications such as automobiles and mobile devices. Traditional MEMS fabrication techniques used for these applications are unsuitable for small-to-medium scale fabrication as the cost are often beyond the market of custom designed and application specific MEMS devices. This niche market can be served by a new method of MEMS fabrication using established technologies in post-semiconductor manufacturing processes (PSM) and printed circuit board (PCB). Packaging industry have approached the scale necessary for the creation of MEMS devices and are not enabled to create functional microdevices with greater freedom in design techniques and materials as opposed to their silicon counterparts. The demands for MEMS-based optical routing, switching and sensing devices are well established and the works presented shows methods of manufacturing optical MEMS devices using laminate materials and processes. Laminate based optical microphones, structural health monitors, multichannel optical interconnect and 1X2 optical switches have been manufactured and demonstrated along with preliminary results. Sensors and waveguides have been integrating within electro-opto circuit boards to demonstrate integrated optical components within laminate devices and packaging for chip-to-chip communication and high-performance sensing in packaging.