Lead-free solders in surface mount electronic assemblies: Designs for quality and reliability
by Dang, Tung C., M.S.Q.A., CALIFORNIA STATE UNIVERSITY, DOMINGUEZ HILLS, 2011, 59 pages; 1507394

Abstract:

The global transition to lead-free soldering is happening now. However, many high reliability electronic companies specializing in medical, military and space products and a few in commercial industries are not ready for the transition because of their concerns regarding the reliability of the design and manufacturing techniques using the lead-free soldering technology.

The correct selection of materials, design and process plays an important role to offer equivalent levels of reliability as tin-lead soldering that passes 500 thermal cycles using industry's standard. With the right solder paste types, solid stencil design and effective thermal profile, voids in BGA can be controlled fewer than 10% against industry's standard 25%. High thermal glass printed circuit board (PCB) is needed to tolerate high temperature reflow process. There is no evidence or indication of tin whisker when using solder alloy 96.5% tin-3% silver-0.5% cooper (SAC305).

 
AdviserRobert Spencer
SchoolCALIFORNIA STATE UNIVERSITY, DOMINGUEZ HILLS
SourceMAI/ 50-03, p. , Jan 2012
Source TypeThesis
SubjectsElectrical engineering; Industrial engineering; System science
Publication Number1507394
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