Flexible electronics is an emerging field with potential applications such as large area flexible displays, thin film solar panels, and smart prosthesis, to name a few. Promising future aside, there are challenges associated with flexible electronics including high deformability requirements, needs for new manufacturing techniques and high performance permeation barriers. This thesis aims to explore possible solutions to address these challenges. First, a thin stiff film patterned with circular holes is proposed as a deformable platform to be used in flexible electronics in either component and circuit level. Second, we explore possible pathways to improve the quality of transfer printing, a nanofabrication technique that can potentially enable roll-to-roll printing of flexible devices. Third, we investigate the failure mechanism of multilayer permeation barriers for flexible electronics and offer an improved design to achieve better mechanical reliability.