In order to meet growing consumer expectations, EMS PCBs have become increasingly complex in circuit density design while attempting to maintain desired miniaturization and rapid processes. It is therefore, critical for PCB inner layer alignment to be rigorously controlled as through-hole and via deviation allowances continue to decrease. In addition, increased emphasis placed on measurement factors including translation and scalar accuracy would reduce the potential for error and scrap, therefore diminishing overall manufacturing expenditures. The purpose of this investigation is three-fold. First, overall PCB registration process concepts will be researched. Second, identification and classification methods including Statistical Process Control Charts are investigated. Lastly, development of an application for the registration process is illustrated. Overall, it is expected that this line of research will lead to better classification methods, assist in decision making processes, provide more efficient time utilization for engineers, reduce company expenses, assist with PCB precision, and end-consumer satisfaction.